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Nano Precision Semiconductor Test & Handling Systems

Japanese-Engineered, Cost-Effective Solutions for Backend Semiconductor Manufacturing

Nano Precision (Japan Nano Precision Co., Ltd.) provides advanced semiconductor test systems and device handling platforms designed for high accuracy, high throughput, and production reliability. With R&D centers in Japan and a global manufacturing footprint, Nano combines Japanese engineering standards with competitive cost modeling to support today’s demanding semiconductor production environments.

About Nano Precision

Established as a dedicated brand in 2024 with more than 15 years of industry development experience, Nano Precision focuses on the design, application engineering, and integration of semiconductor test handlers and parametric testers.


The company supports:

 

  • Discrete and power semiconductor testing

  • SOC and RF device testing

  • Temperature-controlled handling systems

  • Wafer sort and final test applications

  • Custom integration and advanced process support


Nano’s engineering teams in Fukuoka and Saitama lead platform development and applications support, while strategic manufacturing partnerships enable scalable production capacity and responsive delivery.

Device Handling Systems

Nano Precision Turret-Based Handler
Nano Precision Temperature Handler
Nano Precision Bare Die Handler

Nano offers turret-based and pick-and-place handlers engineered for production stability and flexibility.

Applications

  • Discrete & small-signal devices

  • Power semiconductors

  • QFN / DFN / SOP / TSSOP

  • WLCSP, CSP, KGD

  • IGBT modules

  • Analog and mixed-signal devices

These systems are designed for repeatability, uptime, and simplified integration into existing production lines.

Key Capabilities

  • Throughput up to 65K UPH (model dependent)

  • Dual and Tri-temperature options (Hot/Cold/Ambient)

  • Temperature range from –55°C to 200°C (Tri-Temp models)

  • Parallel multi-site configurations

  • Integrated laser marking

  • Integrated vision inspection

SOC & RF Test Systems – J8000 Family

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Nano Precision J8000 family tester
Nano Precision J8000 family tester

The J8000 platform family supports high-parallel testing across a wide range of devices.

Applications

  • MCU (8–32 bit)

  • Embedded memory (Flash, EEPROM, SRAM)

  • PMIC devices

  • Signal chain (ADC, DAC, audio)

  • MEMS

  • RFIC and IoT transceivers

The architecture is designed for high-volume, high-parallel production while maintaining flexibility for engineering and R&D configurations.

Key Capabilities

  • Up to 5120 digital pins (model dependent)

  • Up to 1.6 Gbps performance (J8800 model)

  • Multi-core and multi-domain configurations

  • Wafer sort and final test support

  • Identical interface and software architecture across the platform family

Discrete & Power Test Systems – J Family

Nano Precision J810
Nano Precision J810HP
Nano Precision J3000

The discrete and power test systems of the Nano J Series support a broad range of high-voltage and high-current applications.

Configurations

  • Up to 1500V / 50A (J810HP)

  • Extended configurations up to 4500V / 1200A (J3000 extended)

  • Multi-site testing options

  • LCR, UIS, dVDS, and DPT capabilities

These systems are well-suited for automotive, industrial, and high-reliability power semiconductor production.

Supported Devices

  • Diodes

  • Transistors

  • MOSFETs

  • SCR

  • IGBT modules

Nano Precision handler

Integrated Vision & Inspection Technology

Nano Precision integrates NGV (Nano Global Vision) inspection technology directly into its handling platforms.

Inspection capabilities include:

  • 2D and 3D inspection

  • Mark and OCR verification

  • End-view and side-view inspection

  • In-tape inspection

  • Pin orientation and defect detection

  • AI Vision capability

The vision platform is designed for high accuracy and repeatability at production speeds, with configurable magnification and resolution options to support a wide range of package types.

NANO auto reels

Back-End Test & Finishing Solutions

Beyond handlers and testers, Nano supports broader back-end production requirements, including:

  • Automatic reel changers

  • Tape & reel material solutions

  • Test contacting design

  • Wafer-level package handling

  • Customized PCB and software development kits

This integrated approach allows customers to streamline inspection, test, and finishing operations while maintaining cost efficiency and production scalability.

Why choose Nano Precision for your semiconductor needs?

Nano Precision combines:

  • ​Japanese engineering standards

  • Competitive global cost modeling

  • Flexible customization (hardware and software)

  • Regional channel support

  • Continuous quality and technology improvement

Its focus is practical: delivering reliable, production-ready systems that balance performance, uptime, and capital efficiency.

Nano Precision Solutions – North American Support

Furlong Tech represents Nano Precision in North America and provides direct access to technical discussions, budgetary proposals, and application engineering coordination.


If you are evaluating any of the solutions below, we welcome the opportunity to review your requirements:

  • Tri-temp handling systems

  • SOC or RF test platforms

  • Discrete and power semiconductor testers

  • Integrated back-end test solutions

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